Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect

ISBN-13: 9783639111309 / Angielski / Miękka / 2008 / 144 str.

Sunjung Kim

O autorze

Dr. Sunjung Kim earned his Ph.D. in Engineering Science
(Materials Engineering) at Rensselaer Polytechnic Institute in
2003. His research interest is the electrochemical application in
microelectronics, energy storage, and corrosion. He is now an
Assistant Professor of Materials Science and Engineering at the
University of Ulsan in Korea.