Ceramic Armor and Armor Systems II: Proceedings of the 107th Annual Meeting of the American Ceramic Society, Baltimore, Maryland, USA 2005

ISBN-13: 9781574982480 / Angielski / Miękka / 2005 / 168 str.

Medvedovski; Eugene Medvedovski

Opis

Contains papers on the development and incorporation of ceramic materials for armor applications. Topics include impact and penetration modeling, dynamic and static testing to predict performance, damage characterization, non-destructive evaluation and novel material concepts.

Spis treści

Ceramic Armor Development and Study.

Advanced Ceramics for Personnel Armor: Current Status and Future (E. Medvedovski).

Characterization of AlON^TM Optical Ceramic (T.M. Hartnett, C.T. Warner, D. Fisher, W. Sunne).

Synthesis of Dense B₄C–SiC–TiB₂ Composites (S. Hayun, N. Frage, H. Dilman, V. Tourbabin, M.P. Dariel).

Biomorphic Reaction Bonded Silicon Carbide Ceramics for Armor Applications (B. Heidenreich, M. Gahr, E. Medvedovski ).

Reaction–Bonded SiC Composites without Residual Si (J.P. Hurley, V. Singh, J.A. Hamling).

Microstructural Engineering of the Si–C–Al–O–N System (R.M. Flinders, D. Ray, A. Anderson, R.A. Cutler).

Ceramic–Polymer Composites for Ballistic Protection (P. Colombo, E. Medvedovski, F. Zordan).

Grain Boundary and Triple Junction Chemistry of Silicon Carbide with Aluminum and Aluminum Nitride Additive (E. Pabit, S. Crane, K. Seiben, D.P. Butt, D. Ray, R.M. Flinders, R.A. Cutler ).

Defect Engineering of Samples for Non–Destructive Evaluation (NDE) Ultrasound Testing (R. Brennan, R. Haber, D. Niesz, J. McCauley).

Defining Microstructural Tolerance Limits of Defects for SiC Armor (M.V. Demirbas, R.A. Haber).


Fracture Mechanism of Ceramic Armor.

Characterization of Subsurface Damages of Static and Dynamic Indented Armor Ceramics: SiC and Si₃N₄ (J.H. Kim, Y.G. Kim, D.K. Kim).

Compressive Failure Threshold of Brittle Materials (E.B. Zaretsky, V.E. Paris, G.I. Kanel, A. Rajendran).

Dynamic Response of B₄C–SiC Ceramic Composites (S. Hayun, N. Frage, M.P. Dariel, E. Zaretsky, Y. Ashuah).