Alumina: Processing, Properties, and Applications

ISBN-13: 9783642823060 / Angielski / Miękka / 2011 / 330 str.

E. D. Rre; H. H. Bner

Opis

This is the third book in the new series "Material Research and Engineering," devoted to the science and technology of materials. "MRE" evolves from a previous series on "Reine und Angewandte Metallkunde," which was edited by Werner Koster until his eightieth birthday in 1976. For the new series, the presentation as well as the scope had to be modified. In particular, the scientific and technological links between volumes on metallic, non-metallic, and composite materials should reflect the successful development of materials science and engineering within the last two decades. Thus, the material provided by Dorre and Hlibner for the present volume is partic ularly welcome. Alumina as a ceramic material has received very large attention as an object of scientific investigation in all of its aspects. Additionally, it plays a leading role as a nonmetallic material in many fields of technical appli cation. This book deals with both aspects: in Chapter 2 (physical properties) and 3 (me chanical properties), H. Hlibner presents an outstanding documentation of what one might call the science of alumina, based on 560 literature references and 15 years of personal experience gained from experimental and theoretical work in university laboratories in Erlangen, Rio de Janeiro, and Hamburg. In Chapter 4 (fabrication) and 5 (applications), E."

Spis treści

1 Introduction.- 1.1 Scope of the Book.- 1.2 General Remarks on the Use and the Behavior of Ceramic Materials.- 1.3 The History of Alumina.- 1.4 Preceding Summarizing Literature on Alumina.- 2 Physical Properties.- 2.1 Structure.- 2.2 Thermal Properties.- 2.3 Diffusion.- 2.3.1 General Remarks on Diffusion Phenomena in Ceramics.- 2.3.2 Intrinsic Diffusion and Disorder Mechanism.- 2.3.3 Extrinsic Diffusion.- 2.3.4 Problems in Determining the Diffusion Coefficient.- 2.3.5 Diffusion Data.- 2.4 Electrical Conductivity.- 2.5 Sintering and Grain Growth.- 2.5.1 Fundamental Sintering Mechanisms in Al2O3.- 2.5.2 Intermediate and Final-Stage Sintering.- 2.5.3 Influence of Additives.- 2.5.4 Effect of MgO.- 2.5.5 Influence of Atmospheres.- 2.5.6 Grain Growth.- 2.6 Hot Pressing.- 2.7 Segregation.- 3 Mechanical Properties.- 3.1 Elastic Properties.- 3.2 Fracture Strength.- 3.2.1 The Strength of Ceramics.- 3.2.2 Fracture Energy.- 3.2.3 Types of Flaws.- 3.2.4 Strength Data.- 3.2.5 Strength-Grain Size Relationships.- 3.3 Time-Dependent Strength and Subcritical Crack Growth.- 3.3.1 The Model of Time-Dependent Strength.- 3.3.2 Subcritical Crack Growth Data.- 3.3.3 Fatigue Data.- 3.3.4 Mechanisms of Slow Crack Growth in Alumina.- 3.4 Thermal and Mechanical Shock Resistance.- 3.4.1 Thermal Shock Properties.- 3.4.2 Mechanical Shock Properties.- 3.4.3 Crack Healing.- 3.5 Plastic Deformation.- 3.5.1 Slip.- 3.5.2 Twinning.- 3.5.3 Hardness.- 3.5.4 Abrasive Wear.- 3.6 Creep.- 3.6.1 Basic Creep Mechanisms.- 3.6.2 Creep of Pure and MgO-Doped Alumina.- 3.6.3 Effect of Other Dopants.- 3.6.4 High Temperature Failure Mechanisms.- 3.7 Strengthening Mechanisms.- 3.7.1 Second Phase Dispersions.- 3.7.2 Compressive Surface Stresses.- 3.7.3 Transformation Thoughening.- 4 Fabrication.- 4.1 Preparation of Powders.- 4.2 Forming.- 4.2.1 Dry Pressing.- 4.2.2 Hydrostatic Molding.- 4.2.3 Extrusion.- 4.2.4 Injection Molding.- 4.2.5 Hot Pressing.- 4.3 Sintering.- 4.4 Hard Machining.- 4.5 Quality Control.- 4.6 Manufacturing Tolerances.- 4.7 Principles of Design.- 5 Applications.- 5.1 Electronic Applications.- 5.1.1 Metal-to-Ceramic Bonding.- 5.1.2 Spark-Plug Insulators.- 5.1.3 Components and Housings for Electron Tubes.- 5.1.4 Discharge Lamps.- 5.1.5 Microelectronics.- 5.2 Mechanical Engineering Applications.- 5.2.1 Thread Guides for Textile Machines.- 5.2.2 Wire Drawing Step Cones.- 5.2.3 Paper Machine Covers.- 5.2.4 Bearings.- 5.2.5 Cutting Tools.- 5.3 Medical Applications.- 5.3.1 Artificial Joints.- 5.3.2 Dental Implants.- 5.3.3 Maxillary Reconstructions.- 5.4 Armor Applications.- 5.5 Other Applications.- References.