Part 1: Understanding through Continuum Theory 1. Numerical Analysis of Contact Mechanics between a Spherical Slider and a Flat Disk with Low Roughness considering Lennard–Jones Surface Forces 2. Equilibrium Vapor Adsorption and Capillary Force: Exact Laplace–Young Equation Solution and Circular Approximation Approaches 3. Which Fractal Parameter Contributes Most to Adhesion? 4. Effects of Contacting Surfaces on MEMS Device Reliability 5. A van der Waals Force-Based Adhesion Model for Micromanipulation Part 2: Computer Simulation of Interfaces 6. Lattice Gas Monte Carlo Simulation of Capillary Forces in Atomic Force Microscopy 7. Large Scale Molecular Dynamics Simulations of Vapor Phase Lubrication for MEMS 8. Atomistic Factors Governing Adhesion between Diamond, Amorphous Carbon and Model Diamond Nanocomposite Surfaces Part 3: Adhesion and Friction Measurements 9. Theoretical and Experimental Study of the Influence of AFM Tip Geometry and Orientation on Capillary Force 10. Odd–Even Effects in the Friction of Self-Assembled Monolayers of Phenyl-Terminated Alkanethiols in Contacts of Different Adhesion Strengths 11. The Pull-Off Force and the Work of Adhesion: New Challenges at the Nanoscale 12. Interfacial Adhesion between Rough Surfaces of Polycrystalline Silicon and Its Implications for M/NEMS Technology 13. Effect of Air–Plasma Pre-treatment of Si Substrate on Adhesion Strength and Tribological Properties of a UHMWPE Film Part 4: Adhesion in Practical Applications 14. A Review of Adhesion in an Ohmic Microswitch 15. Characterization of Gold–Gold Microcontact Behavior Using a Nanoindenter Based Setup 16. Characterization and Adhesion of Interacting Surfaces in Capacitive RF MEMS Switches Undergoing Cycling 17. Molecular Mobility and Interfacial Dynamics in Organic Nano-electromechanical Systems (NEMS) Part 5: Adhesion Mitigation Strategies 18. Microscale Friction Reduction by Normal Force Modulation in MEMS 19. Microchannel Induced Surface Bulging of a Soft Elasto
Kim, Seong H.; Dugger, Michael T.; Mittal, Kash L.