ISBN-13: 9786200287519 / Angielski
Lead is banned in alloy making processes due to its inherent toxicity. Therefore lead cannot be used in solder making. Lead was used in the solder alloy making process for more than 2000 years. This leads to a need of lead free solder alloys which can replace the old Sn-Pb alloy. Not only the ban of lead, need for solder alloys which can be used in dense electronic assemblies with less pitch, need of high temperature solder alloys and the environmental tag also lead to the search for new solder alloys. Sn-Ag-Cu were discovered and is very popular. The more percentage of Ag in the alloy will add cost to the alloy. Then the researchers were searching for new low cost alloys. This book reviews the important lead free solder alloys and processes using in the present scenario which can replace Sn-Pb.