A Concise Introduction to Ceramics

ISBN-13: 9789401169752 / Angielski / Miękka / 2012 / 154 str.

George Phillips

Opis

to Cera1l1ics by George C. Phillips ~ V AN NOSTRAND REINHOLD ~ ~ ____ New York Copyright ('> 1991 by Van Nostrand Reinhold Softcover reprint of the hardcover 1 st edition 1991 Library of COnRreSS Catalog Card Number 91*19587 ISBN*13: 978*94*011--6975*2 All rights eserve r d. No part of this work covered by the copyright hereon may be rcproduccd or uscd in any form or by any means-graphic. electronic. or meehaniclli. including photocopying. recording. taping. or information storage and retrieval systems-without written permission of the publisher. Manufactured in the United States of America Published by Van Nostrand Reinhold 115 Fifth Avenue New York. New York 10003 Chapman and Ha ll 2-6 Boundary Row London. SEI SHN. England Thomas Nelson Australia 102 Dodds Street South Melbourne 3205 Victoria. Australia Nelson Canada 1120 Birchmounl Road Scarborough. Ontario M IK 5G4. Canada 16 15 14 13 12 II 10 9 8 7 6 5 4 3 2 Library or Congress Cataloging-in* Publication Data Phillips. George C .. 1937- A concise inlrodu!;tion to ceramics/by George C. Phillips. p. cm. Includes bibliographical referen!;es and index. ISBN-13: 978-94-011--6975-2 e-ISBN-13: 978-94-011--6973-8 001:10: 1007/978-94-011--6973-8 I. Cerami!;s. L Tille.

Spis treści

I—Overview of Ceramics.- 1. Ceramic Materials.- 1.1 Introduction.- 1.2 Ceramic Materials.- 1.3 Terminology.- 1.4 Formula Notation.- 2. Ceramic Raw Materials.- 2.1 Naturally Occurring Minerals.- 2.2 Manufactured Raw Materials.- 3. Nature of Clay.- 3.1 Physics of Clay.- 3.2 Clay-Water Systems.- 4. Forming from Powders.- 4.1 Powder Preparation.- 4.2 Dry Pressing.- 4.3 Plastic Forming.- 4.4 Casting.- 4.5 Thermal Treatments.- 5. Forming from Melts.- 5.1 Cooling Curves.- 5.2 Glass Forming Methods.- 5.3 Thermal Conditioning Glass.- 6. Miscellaneous Forming Techniques.- 6.1 Coatings.- 6.2 Single Crystals.- 6.3 Miscellaneous Formings.- 7. Traditional Ceramic Industries.- 7.1 Abrasives.- 7.2 Refractories.- 7.3 Whitewares.- 7.4 Structural Clay Products.- 7.5 Glasses.- 7.6 Porcelain Enamels.- 7.7 Cements.- II—The Nature of Ceramic Materials (Bonding/Crystal Concepts).- 8. Atomic Structure.- 8.1 Background.- 8.2 Electronic Configurations.- 8.3 Ionization.- 9. Bonding and Crystal Chemistry Concepts.- 9.1 Types of Bonding.- 9.2 Material Classes.- 9.3 Pauling’s Rules.- 9.4 Coordination Numbers.- 9.5 Bond Strength.- 10. Silicate Stuctures.- 10.1 Basis.- 10.2 Types of Silicates.- 10.3 Layer Minerals.- 11. Structure of Glass.- 11.1 Crystalline versus Glassy.- 11.2 Glass Formers.- 11.3 Glass Modifiers.- 11.4 Structure and Composition versus Properties.- 12. Oxide Crystal Structures.- 12.1 Basis.- 12.2 AmXn Compounds.- 12.3 ABmXn Compounds.- III—Characterization of Ceramic Materials.- 13. Analytical Techniques.- 13.1 Introduction.- 13.2 Microscopy.- 13.3 X-Ray Methods.- 13.4 Surface Measurements.- 14. Properties and Requirements of Ceramic Materials.- 14.1 Introduction.- 14.2 Properties.- 14.3 Requirements.- 15. Ceramic Surface Characteristics.- 15.1 Introduction.- 15.2 Dry-Pressed Alumina Surfaces.- 15.3 Surface Variations versus Processing Techniques.- 15.4 Quantitative Surface Techniques.- 16. Ceramic Strength Considerations.- 16.1 Introduction.- 16.2 Strength Measurements.- 16.3 Fracture Mechanics.- IV—Hi-Tech Applications of Ceramics.- 17. Structural and Electronic Applications.- 17.1 Introduction.- 17.2 Structural Applications.- 17.3 Magnetic Ceramics.- 17.4 Electronic Applications.- 18. Integrated Circuit Technology.- 18.1 Introduction.- 18.2 Semiconductors.- 18.3 Integrated Circuit Processing.- 18.4 Transistor Structures.- 18.5 Application and Development of Semiconductors.- 19. Ceramic Packaging of IC Devices.- 19.1 Introduction.- 19.2 Package Designs.- 19.3 Processing of Planar Substrates.- 19.4 Future Trends in Planar Ceramic Packaging.- 19.5 Multilayer Ceramics (MLC).- 20. The Future of Ceramics.