3d-Mid: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers » książka
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3d-Mid: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
ISBN-13: 9781569905517 / Angielski / Twarda / 2014 / 356 str.
3d-Mid: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
ISBN-13: 9781569905517 / Angielski / Twarda / 2014 / 356 str.
cena 722,88 zł
(netto: 688,46 VAT: 5%)
Najniższa cena z 30 dni: 694,32 zł
(netto: 688,46 VAT: 5%)
Najniższa cena z 30 dni: 694,32 zł
Termin realizacji zamówienia:
ok. 13-18 dni roboczych.
ok. 13-18 dni roboczych.
Darmowa dostawa!
This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
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