In most applications of piezoelectric devices, electric energy is applied to the devices via lead wires soldered on the electrodes of piezoelectric components. At high input voltage, large vibration amplitudes or high temperature, the lead wires may fall off, causing the breakdown of devices. The soldered wire may limit the miniaturization, affect the properties of micro and nano devices and hinder the applications of piezoelectric devices in rotary mechanisms. The fundamental limitations of direct drive of piezoelectric devices via lead wires soldered on the electrodes necessitate the...