The International Technology Roadmap for Semiconductors (ITRS) projects that by 2011 over one billion transistors will be integrated into a single monolithic die. The wiring system of this billion-transistor die will deliver power to each transistor, provide a low-skew synchronizing clock to latches and dynamic circuits, and distribute data and control signals throughout the chip. The resulting design and modeling complexity of this GSI multilevel interconnect network is enormous such that over one hundred quadrillion coupling inductances and capacitances throughout a nine-to-ten-level metal...

This is an EXACT reproduction of a book published before 1923. This IS NOT an OCR'd book with strange characters, introduced typographical errors, and jumbled words. This book may have occasional imperfections such as missing or blurred pages, poor pictures, errant marks, etc. that were either part of the original artifact, or were introduced by the scanning process. We believe this work is culturally important, and despite the imperfections, have elected to bring it back into print as part of our continuing commitment to the preservation of printed works worldwide. We appreciate your...