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This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.  The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters...

Processing & Characterization provides information on most implemented lead-free solder processing, reaction mechanism and characterization techniques involved. This book also includes a newly invented composite lead-free solder processing and characterization techniques. The resulted presented in this book were part of the experimental works at Universiti Malaysia Perlis (UniMAP) and National University of Malaysia (UKM). The chapters are organized around the following subject areas: solder developments, fundamental issues, mechanical and electrical properties, the factors affecting the...

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14thand 15thof Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced...

This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform...