Chips 2020, Vol. 2: New Vistas in Nanoelectronics

ISBN-13: 9783319220925 / Angielski / Twarda / 2015 / 319 str.

Bernd Hofflinger; Bernd Hoefflinger

Opis

The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020.The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s."

Recenzje

"CHIPS 2020 Volume 2 has sought to present the latest developments in the most critical and promising areas relevant to energy efficient electronics. ... This book is suitable for the student, researcher or recent graduate that wants to understand where the challenges lie in chips and for managers, investors and policy makers. It is suitable for all and is written with the issue of sustainability and engineering responsibility at its core." (EETimes Europe Analog, analog-eetimes.com, November, 2015)

Spis treści

News on 8 Chip-Technologies.- Monolithic 3D Integration.- Comprehensive, Reliable, Low-Power Electronics.- Analog for a Digital World.- Interconnects, Communication.- Developments in the Chip Market.- ITRS, The 2014-2029 International Technology Roadmap of Semiconductors.- Nanolithography.- Power-Efficient Design.- Super processors and Super computers.- Memory.- Hybrid 3D Integration for Wireless Multimedia.- Technology for the Next-Generation Mobile User.- MEMS –Micro-Electromechanical Systems.- Vision Chips and Cameras.- Digital Neural Networks.- Retinal Implants.- The Human-Brain Projects.- Energy Harvesting and Chip Autonomy.- 2020 World with Chips.

O autorze

Bernd Höfflinger has a lifelong career with semiconductor chips. After starting at Siemens Research, he was invited to join the faculty at Cornell University, where he set up and taught the first graduate course on integrated circuits (IC s). He continued as the first product manager for MOS IC s, Siemens, Munich. With that experience, he became a co-founder of the University of Dortmund, where he built the first public pilot line for IC s in Europe, which realized the world s first all-ion-implanted Bipolar-CMOS process. As Head of the Electrical Engineering Departments at the University of Minnesota and at Purdue University, he led the major expansions of their electronics programs. He was invited back to Germany to build and lead the Institute for Microelectronics Stuttgart. As a public enterprise for contract R&D, it became one of the first certified manufacturing lines in Europe for CMOS Application-Specific Circuits. It has become the world leader in the development and manufacture of test masks for every next-generation lithography since the 1990's. Bernd Höfflinger has been the recipient or co-recipient of numerous scientific and best-product awards. He is a member of the Dusseldorf Academy of Sciences