wyszukanych pozycji: 2
Three Dimensional System Integration: IC Stacking Process and Design
ISBN: 9781489981820 / Angielski / Miękka / 2014 / 246 str. Termin realizacji zamówienia: ok. 20 dni roboczych. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve...
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, ...
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cena:
194,52 zł |
Three Dimensional System Integration: IC Stacking Process and Design
ISBN: 9781441909619 / Angielski / Twarda / 2010 / 246 str. Termin realizacji zamówienia: ok. 20 dni roboczych. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve...
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, ...
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|
cena:
194,52 zł |